Trends in Bonding Technology Driven by the AI Era

    Mr. Chaoqun Ren

    General manager, Wisdom SemiTeC (Jiangsu) Technology Co., Ltd.

Abstract: 

AI applications are driving the performance bottleneck of chips from process scaling toward interconnect delay and power consumption, positioning bonding technology as an increasingly definitive path in the post-Moore era. Currently, bonding technology has permeated applications such as CMOS image sensor, 3D NAND, and AI Chiplet integration, while demonstrating significant potential across logic, memory, packaging, optical communications, and display applications. This presentation will provide a comprehensive overview of the latest advances in bonding technology application, covering both wafer-to-wafer and die-to-wafer bonding techniques, with a focus on emerging application scenarios. Furthermore, bonding technology still faces multifaceted long-term challenges. This presentation will summarize these technical challenges, review relevant fundamental research progress, and explore potential future solutions.

Speaker's Biography:

Mr. Ren Chaoqun has deep dived in the semiconductor equipment manufacturing sector, focusing on the research and development of core technologies of semiconductor equipment, and has accumulated rich experience in research, design, development, and management.

Currently, he serves as CEO of Wisdom SemiTeC (Jiangsu) Technology Co., Ltd., fully in charge of the company's operation and the formulation and implementation of its technical strategy. He has led the research and development of the company's core hybrid bonding products and continuously explores and innovates in the uncharted territory of semiconductor technology.