Innovative Equipment Solutions for Advanced Packaging of AI Chips

    Mr. Benz ZHAO

    CTO, Guangdong iStar Technology Equipment Co., Ltd.(iSTAR)

Abstract: 

iStar introduce iHCB3000 hybrid bonding equipment's innovative architecture to improve bonding accuracy and throughput, and demonstration of initial testing results.

Speaker's Biography:

Mr. Benz Zhao has nearly 20 years of experience in the field of semiconductor equipment research and development. He specializes in system architecture design, system analysis, design of innovative solutions, and solve complex cross-disciplinary technical issues. He has in-depth understandings on the systems architecture and process technology of lithography equipment, chip and wafer bonding equipment. At iStar, he focuses on the innovative technology development of high-end semiconductor process equipment.