Plasma Activation in the Downstream Region of a Surface-Wave-Excited Plasma for Hybrid Bonding

   Dr. Yasuhiro Morikawa

   Manager, ULVAC, Inc.

Abstract:

TBD

Speaker's Biography:

Yasuhiro joined ULVAC in 1997. He earned his master's in electrical engineering from the University of Toyo in 1997. And he received a Dr. in Material Engineering from the University of Tokyo in 2003. He is currently working as a manager of institute of advanced technology at ULVAC in Shizuoka, Japan. His main interests are development of plasma technologies and equipment for the advanced packaging of integrate of semiconductor chip. He is a member of the Japan Society of Applied Physics (JSAP) and the Japan Institute of Electronics Packaging (JIEP).

And program committee of international symposium on dry process (DPS), and General chair of technical program committee of international conference on electronics packaging 2026 (ICEP2026).