Fusion & Hybrid Bonding: Driving Application Performance, Power and Cost by Mixing and Matching Semiconductor Technologies

    Mr. Thomas Pleschke

    Business Development, EV Group (EVG)

Abstract: 

As traditional semiconductor scaling has been coming to an end, bonding technologies on wafer but also die level have become a cornerstone and key ingredient for keeping Moore’s law alive. Initially rooted in MEMS applications, fusion and hybrid bonding have seen tremendous advancements over the past decades and meanwhile are widely deployed in high-volume manufacturing for applications such as image sensors or advanced memories.

The presentation will focus on the aspect of bonding as a "More than Moore" technology, meanwhile also increasingly enabling "More Moore". Attendees will be provided with an overview of related application areas. Next to chip-let architectures also co-packaged optics (CPO) is moving into the spotlight, driven by an AI and data center hype. A comprehensive overview of wafer and die bonding approaches enabling heterogeneous photonic integration, is presented. These include plasma-activated fusion bonding, oxide-free direct bonding, as well as hybrid bonding techniques. While former support the integration of diverse materials, including III–V semiconductors, and thin-film lithium niobate onto silicon photonics platforms, latter serve a tightly coupled integration of photonic with electronic integrated circuits (PICs & EICs) by ultra-short interconnects with high density and low parasitics, as essential for CPO architectures. 

Speaker's Biography:

Thomas Pleschke drives Business Development for Heterogeneous 3D Integration and Packaging applications at EV Group, in evaluating global market trends, scouting new technologies and developing growth opportunities for EVG's business.

He holds a Master of Science in Engineering degree in Mechatronics as well as a Master's of Law and Business from Johannes Kepler University Linz and brings along more than 20 years of experience in the international semiconductor industry from R&D to business and strategy development.