Process and Material Challenges and Solutions for Ultra-large-scale Chiplet Advanced Packaging

  Dr. Hongbin SHI
  Principal Expert in Electronic Packaging, Awinic Technology Co., Ltd., China

Abstract:

Driven by decisive advantages in yield, cost, and performance, ultra-large-scale Chiplet advanced packaging is poised for explosive growth in AI training/inference, data centers, autonomous driving, cloud computing, and high-speed communications. However, this rapid scaling introduces significant new process and material challenges. Drawing upon extensive industry experience and cutting-edge academic research, this presentation will provide a focused review of prevalent application failure modes, failure analysis methodologies, underlying mechanisms, and targeted improvement strategies. Furthermore, it will outline systematic solutions—spanning design, process, materials, and equipment—to enhance technical capabilities and effectively mitigate these failure risks.

Speaker's Biography: 

Mr. Hongbin Shi received his Master’s degree in Integrated Circuits from Fudan University and his Ph.D. from Waseda University. With over 20 years of experience in R&D, technological innovation, and team leadership at global leading companies such as Samsung (HQ, Korea) and Huawei, he specializes in consumer electronics and chip packaging. His core expertise encompasses process reliability design, virtual simulation, and failure analysis for advanced chip packaging, modules, PCBA, and finished products. He has published 50+ papers in prestigious journals (e.g., Microelectronics Reliability) and conferences (e.g., ECTC), including 4 ICEPT Best Paper Awards. He is also a prolific inventor with 100+ patents filed. Beyond his corporate role, he serves as a Sub-committee Chair/Committee Member for international conferences such as EPTC and ICEPT, Chairman of the IPC-A-610-D CN Technical Committee, a Visiting Researcher at Waseda University, and a Master's Supervisor at Fudan University.