3D chiplet for Optical Package and Power Package

Steve JIN

CEO, OIP technology

Abstract:

Introduce 3rd generation of FOPLP for 3D chiplet used in optical and power application. With flexibility of FOPLP, CPO and optical is able to reduce power loss and package size. 

Speaker's Biography:

Steve JIN has 25 years experience in advanced packaging, an early develop in Cu pillar and FOPLP in 2000 and 2010. 

Steve jin used to work in Apple Singapore, manage optical module and SIP. Before joined Apple, Steve Jin also worked in ST Micro as senior manager of FOWLP and 3D packaging.