Research Progress on Temporary Bonding Technology for Advanced Packaging

Prof. Guoping ZHANG

Deputy Director, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences                                                                                                

Abstract:

With Moore's Law slowing down and wafer fabrication approaching its physical limits, the increased difficulty in fabrication is driving the development of advanced packaging. As a critical process for advanced packaging, temporary bonding and debonding (TBDB) technology primarily supports backside processing and thin-wafer handling to improve the yield of the chip. TBDB materials need to withstand the harsh conditions of high temperature, high vacuum, and chemical corrosion in advanced packaging processes. Among mainstream TBDB methods, laser debonding is widely used due to its advantages of non-contact, controllable energy and high efficiency. However, research on the interfacial separation mechanism and chip damage prevention strategies in laser debonding remains insufficient. To address this issue, we have thoroughly investigated the influence mechanisms of temporary bonding materials, stacking structures and laser parameters on the debonding performance. The research results provide key technical support for the optimized design of TBDB materials and highly reliable debonding of thin wafers, which strongly promotes the development of artificial intelligence, high-performance computing, silicon optical co-sealing and other emerging industries.

Speaker's Biography:

Guoping Zhang, Professor, Ph.D. Supervisor, Deputy Director of the Shenzhen Institute of Advanced Electronic Materials, Deputy Director of the National Key Laboratory of Integrated Circuit Materials, Senior Member of IEEE, National High-Level Talent, Leading Talent of Guangdong Special Support Program, Member of the Youth Innovation Promotion Association of the Chinese Academy of Sciences, and Shenzhen High-Level Overseas Talent. He has been engaged in the research of advanced packaging materials for integrated circuits for a long time, and has presided over more than 10 projects, including the National Natural Science Foundation of China, the Strategic Priority Research Programs of the Chinese Academy of Sciences, the Innovative Scientific Research Team of Guangdong Province, the Guangdong Provincial R&D Project in Key Areas, the Science and Technology Program of Shenzhen, and the Horizontal Cooperation of Enterprises. He has published 115 SCI/EI-indexed papers with 2,695 citations and an H-index of 29, and has applied for more than 70 invention patents and obtained more than 30 authorized patents (including 2 international PCT patents). He developed new temporary bonding material with UV/green/infrared laser release capability has successfully realized the large-scale commercialization, and won the second prize of Shenzhen Scientific and Technological Progress.