Moldex3D Injection Molding Simulation Analysis Solutions for Advanced IC Packaging and the Latest Technological Innovations

Denny Qin

Suzhou Moldex Analysis Software Co PTY LTD   

Abstract:

As traditional transistor scaling faces theoretical limitations, advanced packaging has emerged as a powerful enabler for "More-than-Moore" technologies. By leveraging advanced packaging, it becomes feasible to integrate various functional chips—each potentially with different wafer nodes, wafer sizes, and functionalities—into a single package, paving the way for future applications in 5G, HPC, and AIoT devices.

To help the audience better understand the advantages of advanced packaging, this presentation from Moldex3D will introduce a range of differentiated packaging process technologies. Key topics include major technological trends, process challenges, corresponding manufacturing approaches, materials, and simulation solutions using Moldex3D.

As traditional transistor scaling faces theoretical limitations, advanced packaging has emerged as a powerful enabler for "More-than-Moore" technologies. By leveraging advanced packaging, it becomes feasible to integrate various functional chips—each potentially with different wafer nodes, wafer sizes, and functionalities—into a single package, paving the way for future applications in 5G, HPC, and AIoT devices.

To help the audience better understand the advantages of advanced packaging, this presentation from Moldex3D will introduce a range of differentiated packaging process technologies. Key topics include major technological trends, process challenges, corresponding manufacturing approaches, materials, and simulation solutions using Moldex3D.

Main Topics Covered:

● Advanced Packaging Market and Technology Trends.

● Moldex3D IC Package Solution.

Main Topics Covered:

● Advanced Packaging Market and Technology Trends.

● Moldex3D IC Package Solution.                                                                                      

Speaker Biography:

12 years of experience in IC packaging mold flow analysis, with a long-term focus on providing technical support for semiconductor companies such as Chinese Academy of Sciences, Tianshui Huatian Technology, Samsung, Nantong Fujitsu Microelectronics, Jiangsu Changjiang Electronics Technology, and ATX Group. Participated in the development and validation of advanced packaging simulations for products such as HBM, CMOS, and SoC. Also assisted clients in establishing CAE simulation laboratories.

Awards Received:

● Moldex3D 2014 Advanced IC Packaging Simulation Analysis Report.

● Moldex3D IC Packaging and Underfill Special Contribution Award.