Ai-driven Power Package Development Excellence

Haibo FAN

Nexperia Hong Kong 

Abstract:

This talk gives a utilization of Ai in electronic package design by providing enhanced predictive capabilities, BOM selection and process optimization, covering material characterization, functional performance prediction, BOM optimization and reliability performance, etc. Through case studies, it has been demonstrated that AI technologies can be applied in electrical package design, ultimately leading to product development of more efficient and robust products.

Speaker's Biography:

Dr. Haibo Fan, Packaging R&D-Package Design and Modeling, Nexperia Hong Kong. He got his PhD degree from Hong Kong University of Science and Technology (HKUST), then worked in HKUST, Philips LED lighting global R&D Center, NXP Hong Kong and Nexperia Hong Kong with 20+ year experience on simulation, and 15-year industry experience on design and reliability; He authored or co-authored more than 50 peer-reviewed technique publications, published 2 books and 3 book chapters.