2025 Recipient

John Lau

CP Wong Global Electronic Packaging Award

“For contributions to integrated circuit interconnects, semiconductor packaging, and lead-free surfact mount technology.”

John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 535 peer-reviewed papers (385 are the principal investigator), 52 issued and pending US patents (31 are the principal inventor), and 24 textbooks. John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry /academy/ society meetings/conferences to contribute, learn, and share. 

2025 Recipient

Rene Poelma

CP Wong Global Electronic Packaging Junior Award

“For contributions to semiconductor packaging and heterogeneous integration.”

At Nexperia, Dr. Poelma works as a Senior Principal Engineer, specializing in semiconductor packaging, materials, and simulation. He leads the new technology roadmap, focusing on innovative package designs, chip integration, and material applications that deliver reliable, practical solutions. With over six years at Nexperia and nearly a decade of research at TU Delft, he brings a multidisciplinary approach, extensive network, and broad technology knowledge to every project. He values teamwork, effective communication, and independent research. He is an IEEE Senior Member and Chair of the IEEE Electronics Packaging Society (EPS) for the Benelux region.