Advanced Material Solution for SiC Power Packaging
Dr. Jing ZHANG
R&D Director of Heraeus Electronics China
Abstract:
Dr. Zhang Jing will present Heraeus Electronics' cutting-edge advancements in silicon carbide (SiC) power module materials technology, focusing on how the silver-free AMB 2.0 metal brazing technology replaces traditional silver solder with patented alloys to reduce costs while completely eliminating silver migration issues. The presentation will also highlight the core advantages of new high-performance sintering materials in achieving high-temperature stability and ultra-high thermal conductivity, as well as the latest progress in DTS technology for optimizing copper layer precision and thermal performance. The deep integration of these technologies is driving breakthroughs in ultra-high power density and highly reliable, failure-free operation for power modules in new energy vehicles, photovoltaic systems, and energy storage applications, providing system-level material solutions for the industry's transition to a new era of high-reliability and high-efficiency energy systems.
Speaker's Biography:
Dr. Jing Zhang, currently serving as the R&D Director of Heraeus Electronics China, specializes in high-power electronic packaging materials and reliability. He holds a Ph.D. from Delft University of Technology in the Netherlands and has dedicated 15 years to this field. Since joining Heraeus Germany in 2017, Dr. Zhang has shifted his research focus to advanced packaging materials and technologies for third-generation semiconductor devices, as well as their reliability assessment.
Dr. Zhang has published over 40 papers and authored one academic book. He holds several prominent positions in the international academic community, including the founding Chair of the Benelux Chapter of the IEEE Electronics Packaging Society (EPS), Executive Secretary and Packaging Committee Member of the International Technology Roadmap for Wide Bandgap Semiconductors (ITRW), and Technical Committee Member of the ICEPT Conference. Additionally, he serves as a Technical Committee Member of the Shanghai Engineering Research Center for Silicon Carbide Power Devices.
Beyond his professional achievements, Dr. Zhang is currently acting as off-campus master's supervisor at both Fudan University and Shanghai Jiao Tong University.