Advanced Material Solution for SiC Power Packaging

Dr. Jing ZHANG

R&D Director of Heraeus Electronics China   

Speaker Biography:

Dr. Jing Zhang, currently serving as the R&D Director of Heraeus Electronics China, specializes in high-power electronic packaging materials and reliability. He holds a Ph.D. from Delft University of Technology in the Netherlands and has dedicated 15 years to this field. Since joining Heraeus Germany in 2017, Dr. Zhang has shifted his research focus to advanced packaging materials and technologies for third-generation semiconductor devices, as well as their reliability assessment.

Dr. Zhang has published over 40 papers and authored one academic book. He holds several prominent positions in the international academic community, including the founding Chair of the Benelux Chapter of the IEEE Electronics Packaging Society (EPS), Executive Secretary and Packaging Committee Member of the International Technology Roadmap for Wide Bandgap Semiconductors (ITRW), and Technical Committee Member of the ICEPT Conference. Additionally, he serves as a Technical Committee Member of the Shanghai Engineering Research Center for Silicon Carbide Power Devices.

Beyond his professional achievements, Dr. Zhang is currently acting as off-campus master's supervisor at both Fudan University and Shanghai Jiao Tong University.