Low Temperature Bonding Realized by Electrodeposited Cu Microstrucutre Design

Dr. Yunwen WU

Associate Professor, Shanghai Jiao Tong University   

Speaker Biography:

Dr.Wu focuses on advanced interconnect materials for integrated circuits and develop new interconnect technologies for advanced electronic packaging. She has published 50 academic papers in journals such as Acta Materialia and Journal of Materials Science and Technology as the first author or corresponding author, alongside 2 review articles related to interconnects in integrated circuits. She has given more than 10 invited talks at domestic and international academic conferences, and served as the international symposium chairs. Her research is funded by National Natural Science Foundation of China. She has collaborated with the leading companies in the integrated circuit to make efforts on the development of integrated circuit technology.