Damping Property and Vibration Fatigue Lifetime Prediction of Electric Current Stressing Solders

Dr. Wangyun LI

Southwest Jiaotong University 

Speaker Biography:

Wangyun Li, Ph.D. in Engineering, is an Associate Professor at the School of Integrated Circuits Science and Engineering, Southwest Jiaotong University. He serves as the leader of the Electronics Packaging Materials and Reliability Group and was a specially appointed researcher at Osaka University, Japan (August 2022–August 2024). His current research focuses on microelectronic packaging materials and reliability, as well as packaging materials and interconnect reliability for wide-bandgap semiconductor chips. Since 2012, he has been dedicated to studying the reliability of electronic packaging interconnections under electro-thermo-mechanical coupled loads, making him one of the early scholars in China to systematically explore this field. He is the principle investigator (PI) of two National Natural Science Foundation of China (NSFC) projects and two provincial projects, as well as PI and Co-PI of 12 other national and provincial, etc., projects. He has published over 70 SCI/EI-indexed academic papers in his field. As an avid reader of philosophical works, he consistently explores ways to integrate philosophical thinking into scientific research, teaching, and other academic activities, deeply appreciating the benefits of such an approach. The aforementioned academic achievements are both the outcome and the continuation of this philosophical inquiry.