Advancements in Thermal Management Technologies for SiC Power Module Packaging: A Case Study

Prof. Yunhui MEI

Dean, Tiangong University      

Speaker Biography:

Yunhui MEI, Professor and Dean of the School of Electrical Engineering at Tiangong University, has long been engaged in research on power electronic device packaging and reliability. In recent years, he has presided over national projects such as the National "Excellent Young Scientists Fund," Tianjin "Outstanding Young Scientists Fund," National Natural Science Foundation projects, and Aviation Foundation projects. Additionally, he has completed nearly 30 corporate collaborative projects with companies such as Huawei, NIO, and Inovance Technology. He serves as a council member of the China Power Supply Society and Deputy Director of the Components Committee. He has published over 150 academic papers and holds 31 authorized invention patents. His accolades include the IEEE CPMT Young Award, First Prize of the China Power Supply Society Technology Invention Award, First Prize of the China Electrotechnical Society Technology Invention Award, First Prize of the Tianjin Technology Invention Award, the Ministry of Education's Huo Yingdong Education Foundation Youth Science and Technology Award, the Electrotechnical Technology—Zheng Tai Technology Award, the IEEE International Power Electronics Conference (APEC) Best Presentation Award, and the "Special Contribution Award" from the National Third-Generation Semiconductor Technology Innovation Strategic Alliance (CASA).