Advanced Packaging Technologies Enabling the AI-Era

Dr. Terry Wu

Deputy General Manager, Payton Technology   

Abstract:

Advanced packaging (AP) is a key technology to promote the development of future computing systems, especially in the artificial intelligence (AI) field. AP integrates chips with different size, functions, and technology nodes to build a more efficient and flexible integrated chip architecture. The core technologies of AP comprise wafer-level packaging (WLP) technologies such as bumping, RDL, through silicon via (TSV), 2.5D packaging, and 3D packaging, and interconnect technology such as flip chip (FC) and hybrid bonding. By developing these advanced packaging and circuit board technologies, we aim to break through the bottleneck of system performance and achieve the best cost-performance ratio among performance, power consumption, area and cost (PPAC).

Speaker's Biography:

Mr. Terry Wu received DPhil in Inorganic Chemistry from Oxford University, and MS & BS degree in Chemical Engineering from National Taiwan University & National Chung Hsing University, respectively. Dr. Terry Wu is currently working as Deputy General Manager of Payton Technology. Prior to joining Payton, he was Director of Business Development Team, AVP, Samsung Electronics. Before working at Samsung, he was CTO of Chengdu ESWIN System IC and had also held several key positions in SJSemi and TSMC. Dr Wu was granted several awards in recognition of his contribution in advanced packaging, including 2018 Jiangsu Innovative & Entrepreneurial Talent Award, 2019 Taihu Talent Award, 2022 CSTIC Best Young Engineer Award from SEMICON China, 2024 National High-Level Talent, and many others. He has 14 journal and conference papers, 44 US patents and over 194 China patents.