Advanced Packaging Design & Simulation Solutions and Challenges

Dr. Guangchao Lv

Senior R&D Engineer,National Center for Advanced Packaging Co., Ltd.，China

Abstract:

As AI computing power demand surges and chip process scaling slows, advanced packaging has become a core path for system performance enhancement in the post-Moore era. This presentation will explore how system integration trends drive the rapid evolution of 2.5D/3D packaging technologies and share NCAP’s practices in the full design-simulation-verification workflow of its one-stop advanced packaging service platform. We will highlight key capabilities such as PDK‑based co‑design methodologies, signal and power integrity simulation optimization, and wafer‑level warpage control. In addition, we will address major challenges including high‑speed interconnects, integrated power delivery and thermal management, and multiphysics co‑simulation. Finally, we will discuss how collaborative innovation across system, process, and design can accelerate the iteration and deployment of high‑performance chip products.

Speaker's Biography:

Dr. Guangchao Lv currently serves as a Senior R&D Engineer at the National Center for Advanced Packaging Co., Ltd. (NCAP China). His primary research and engineering practice focus on advanced packaging structure design, reliability analysis, and design simulation.