Application of Magnetic Neutral Loop Discharge Plasma in Deep Etching of Low-CTE Glass Substrate for Co-Packaged Optics

Dr. Yasuhiro Morikawa

Manager, ULVAC, Inc.   

Speaker Biography:

Yasuhiro joined ULVAC in 1997. He earned his Master in Electrical engineering from the University of Toyo in 1997. And, he received a Dr. in Material Engineering from the University of Tokyo in 2003. He is currently working as a manager of institute of advanced technology at ULVAC in Shizuoka, Japan. His main interests are development of plasma technologies and equipment for the advanced packaging of integrate of semiconductor chip. He is a member of the Japan Society of Applied Physics(JSAP) and the Japan Institute of Electronics Packaging (JIEP). And, program committee of international symposium on dry process (DPS), and General chair of technical program committee of international conference on electronics packaging 2026 (ICEP2026).