Advanced Wafer Temporary Bonding and Debonding Tape Solutions for 3D Packaging

Mr.Weiqiang.SHEN

Sales Manager，Sekisui (Shanghai) International Trading CO.,LTD  

Abstract: 

As 3D packaging technologies drive the demand for ultra-thin wafer handling, optimizing the Temporary Bonding and Debonding (TBDB) process remains a critical industry challenge. This presentation introduces the latest advancements in TBDB tape solutions, exploring new possibilities for optimizing process compatibility and streamlining manufacturing workflows.

Speaker Biography:

Mr. Shen is a Sales Manager at Sekisui (Shanghai) International Trading Co., Ltd., responsible for semiconductor material sales in China. With prior working experience at Sekisui Chemical’s Japan headquarter and an Economics degree from Osaka University, he focuses on providing practical material support for advanced packaging processes.