Acid Copper Plating Process for RDL Interposer

Dr. Yamaguchi Atsuya

R&D Center, Electronics Development Department, JCU CORPORATION    

Speaker Biography:

Mr. Yamaguchi has been a member of the development staff at JCU Corporation since 2024, JCU is a company that manufactures and supplies surface treatment chemicals. He has been engaged in the development of additives foracid copper electroplating, which are used in electronics applications such as advanced packaging.