Polysilazane-mediated Room Temperature Bonding for Electronics Packaging 

Dr. Kai Takeuchi

Assistant Professor, Tohoku University   

Speaker Biography:

Kai Takeuchi received his Ph.D. degree from the University of Tokyo in 2020 and currently is assistant professor in Tohoku University, Japan. He has been working on low temperature bonding technologies for electronics packaging. He specializes in lowtemperature and roomtemperature wafer bonding technologies, with a research emphasis on surface-activated bonding and polysilazane-mediated SiO₂ interface formation. His work also includes investigations into hybrid metal/oxide bonding and sequential plasma activation methods. He is an active member of professional societies including IEEE Electronics Packaging Society (EPS), The Japan Institute of Electrical Engineers of Japan, and The Institute of Electrical Engineers of Japan.