The Second Wave of PLP for HPC and AI Applications

   Dr. Tanja Braun

    Head of Department, Fraunhofer IZM   

Speaker Biography:

Fan-out Packaging is one of the largest trends in the last decade with the possibility to scale from fraom wafer to panel level packaging. The talk will review the first wave of Fan-out Panel Level Packaging and why it has not evolved as expected. With a look on current trends and developments, the advantages of FOPLP are considered and put in context with the likely occurrence of a second wave of packaging on panel level especially for very large body size packages for HPC and AI applications.