A Novel Expansion Process Using Tape Expansion, Self-Assembly, and Tape Frozen Detachment Technique and Its application to Hybrid Bonding 

Shinya Takyu

Assistant General Manager, LINTEC Corporation, Japan  

Speaker Biography:

Shinya Takyu received the B.E. from The University of Electro-Communications, Tokyo, Japan in 1991. After graduated, he joined the Process & Manufacturing Engineering Center in TOSHIBA Corporation and had been engaged in the development of semiconductor packaging process. He developed the “Dicing Before Grinding” process; well known as DBG and contributed to the thin IC card chip and the 17 layers stack NAND Flash Memory package for mass production. In April 2014, he moved his position to a project manager, LINTEC Corporation in Japan. Since then, he has been working on the development of novel processes using new tape materials and equipment.He is a member of IEEE EPS (Electronics Packaging Society). He was the general chair of ICSJ2017 (IEEE CPMT Symposium Japan 2017). The secretary of IEEE EPS Japan (2019-2020). The Vice Chair of IEEE EPS Japan (2021-2022). The Chair of IEEE EPS Japan (2023-2024). IEEE EPS Board of Governors MEMBERS-AT-LARGE (2025-).