Exploring the Correlation Between Post-Die Bond Epoxy Void and Bond Line Thickness and other Factors on Power Packaging with Silver Sintered Epoxy

James Kim

NXP Semiconductors, Malaysia   

Speaker Biography:

1.Bachelor's degree of Material Engineering , Sungkyunkwan University, South Korea in 2000

2.Over 20 years experience in material & process development for packaging and extensive work in advanced package development (incl. FC package ) at Amkor and NXP. 

3.Currently responsible for new product introduction in OSATs.