PDC-10 Room 2: 16:20-17:50

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PDC-10 Room 2: 16:20-17:50

High Reliability Soldering in Semiconductor Packaging

Dr. Ning-Cheng LEE

Founder of ShinePure Hi-Tech, China

Abstract:

Semiconductor soldering is much more delicate and is very critical for reliability of devices. This course covers the critical parameters governing the reliability for soldering in semiconductor packaging. The reliability discussed includes parameters affecting the intermetallic compounds (IMC), voiding, electromigration, low temperature soldering, high temperature soldering, and electrochemical migration under a variety of material combinations. The failure modes are discussed in details, with preferred choices of materials and designs recommended.

Lecturer Biography:

Ning-Cheng Lee is the founder of ShinePure Hi-Tech. Prior to that, he has been with Indium from 1986-2021, and with Morton Chemical and SCM 1982-1986. He has 30+ years of experience in the development of fluxes and solder materials for SMT industries. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.