Ag-Al Composite Sinter Joining for High-Reliability SiC Power Modules

Prof. Chuantong CHEN

Professor, Osaka University   

Abstract:

In this presentation, we summarize some research findings on the direct low-temperature bonding of micron-sized Ag sinter to aluminum (Al) plates and Al condensers in SiC power modules. We also propose a novel Ag-Al composite sintering interconnection material that aims to achieve lower material costs, improved material plasticity, and microstructural stability under high-temperature service conditions, ultimately ensuring high reliability for SiC power modules. Additionally, we will discuss the bonding mechanism of the Ag-Al interconnection, its microstructural stability at elevated temperatures, and the structural reliability during power cycling.

Speaker's Biography:

Prof. Chuantong Chen received his Ph.D. degree in mechanical engineering from Nagoya Institute of Technology, Japan, in 2015. From 2016 to 2019, he was an assistant professor at the Institute of Scientific and Industrial Research (SANKEN), Osaka University, Japan. In 2020, he was promoted to associate professor at SANKEN, Osaka University, and he is now a full professor at Osaka University, Japan. His research interests include lead-free soldering, Metal particles sinter joining, nano-joining, 3D packaging, and power electronics packaging. He has published more than 220 peer-reviewed papers in these fields. I have contributed one English book and 8 Japanese books in the field of power electronics and packaging. He has received multiple awards and honors, including the IEEE EMPC Best Poster Award, IEEE ICEP Outstanding Technical Paper Award, and the IEEE CPMT Japan Chapter Young Award. Additionally, he has applied for and obtained more than 20 Japanese and international patents, including 8 US patents. He is a Senior Member of IEEE and serves as a technical committee member for IEEE ICEP, IEEE ICEPT, and IMAPS.