Research on Failure Mechanism and Reliability Evaluation of TSV-Based 3D Integrated System
Dr. Guoguang LU
Researcher, China Electronic Product Reliability and Environmental Testing Research Institute Abstract:
In the post-Moore era, advanced packaging technology have emerged as a primary pathway for achieving device miniaturization and high performance, positioning themselves at the forefront of global semiconductor industry competition and serving as a critical strategy for Chinese semiconductor industry to overcome technological barriers. Addressing the key challenges faced by Chinese current TSV-based 3D integration technology—including limitations in defect detection capabilities, ambiguities in failure mechanisms, and deficiencies in standardized evaluation methodologies—our research focuses on advancing the theory of collaborative non-destructive testing for internal defects in TSV-based 3D integration through multi-mechanism fusion. This work further explores the failure mechanisms of critical structural components and develops robust reliability evaluation methodologies. To address these challenges, we have successfully developed a comprehensive non-destructive testing and analysis platform for TSV-based 3D integrated devices, complemented by a reliability analysis and testing platform. Additionally, we have created reliability simulation software grounded in the physics of failure, enabling precise prediction and analysis of device behavior under various conditions. A reliability model database for key structures and devices has been constructed, providing a foundation for data-driven decision-making and optimization. These efforts have culminated in the establishment of a holistic quality and reliability evaluation technology system for TSV-based 3D integrated devices. The significance of these advancements lies in their potential to enhance the high-reliability application of domestically produced devices in critical equipment, thereby supporting the strategic goals of technological self-reliance and industrial competitiveness in China's semiconductor sector. This work not only addresses emergent technical challenges but also contributes to the long-term sustainability and innovation of TSV-based 3D integrated circuit.
Speaker's Biography:
Researcher Guoguang Lu serves as the Deputy Director of the National Key Laboratory of Component Reliability Technology of China Electronic Product Reliability and Environmental Testing Research Institute. In recent years, He has led nearly 20 major research projects at both national and provincial/ministerial levels. His achievements include developing a series of 30 independently researched optoelectronic luminescent device reliability testing instruments, which broke the international technological monopoly. The overall technical specifications of these instruments have reached internationally advanced levels. Additionally, he pioneered a comprehensive 'integrated' evaluation technology for key component reliability within China, which is based on Microscopic defect localization, Failure mechanism analysis, Key parameter characterization, Accelerated life assessment and Reliability design enhancement. This integrated approach enables the realization of understandable failure mechanisms, identifiable microscopic defects, actionable quantitative assessment and controllable quantitative design, which has provided crucial support for advancing the independent development of highly reliable domestic key components and enabling their large-scale application. His related research accomplishments have been recognized with numerous awards, including a first prize of the Guangdong Science and Technology Progress Award, two National Innovation Team Awards, two Second Prizes and two Third Prizes for the provincial level, and one Guangdong Outstanding Patent Award. Up to now, he has been granted 6 invention patents and published over 60 papers.