Thermal Cycle Reliability Challenges and Solutions for SOC Packages in Consumer Electronics

Dr. Hongbin SHI

Principal Expert in Electronic Packaging, Awinic Technology Co., Ltd.    

Speaker Biography:

Mr. Shi Hongbin obtained his master's degree in integrated circuits from Fudan University and his Ph.D. from Waseda University. He has over 16 years of experience in product development, technological innovation, and team building in consumer electronics and semiconductor packaging at renowned companies such as Samsung (headquartered in South Korea) and Huawei. He is proficient in advanced electronic packaging, module, PCBA, and system process reliability design, virtual simulation, and failure analysis. He has published over 40 papers in international journals such as Microelectronics Reliability and at international conferences such as ECTC, with three of them winning the Best Paper Award at ICEPT. He has applied for over 80 patents. He holds positions such as the chairperson/committee member of the technical committee of EPTC & ICEPT, the chairperson of the IPC 610-d CN technical committee, a visiting researcher at Waseda University, and a master's thesis supervisor at Fudan University.