Advanced Utilisation of Machine Learning Models for Package Reliability Analysis

Dr. Karsten Meier

R&D Director, Chengdu ECHINT Technology Co., Ltd.   

Speaker Biography:

Dr. Karsten Meier is with the Institute of Electronic Packaging Technology at the Technische Universität Dresden (Dresden, Germany) since 2006. After studying electrical engineering he received his Ph.D. from Technische Universität Dresden in 2015. During his studies he spent a research visit at the Packaging Research Center at the Georgia Institute of Technology in Atlanta (Georgia, USA). At the Institute of Electronic Packaging Technology he leads the board level reliability group and is in charge as assistant director. His research activities cover projects on packaging technology developments and package reliability for 5G and automotive applications, power electronics, material characterisation, and thermomechanical simulation incl. FEM and ML which all are source for more than 150 papers he authored or co-authored. Also, he supports a research collaboration with the Center for Advanced Life Cycle 

Engineering at the University of Maryland (Maryland, USA) on combined mechanical and thermal loadings on solder interconnections. He chairs the IEEE ECTC sub-committee Thermal/Mechanical Simulation and Characterisation and is member of the ECTC executive committee, is a member of the IEEE EPTC sub-committee Advanced Packaging and the IEEE ESTC sub-committee Reliability of Electronic Devices and Systems. As a reviewer he supports the IEEE EuroSimE conference, the ASME and CPMT societies and the 

Journal of Microelectronics Reliability and other journals.