Trends and Industrial Practices of STCO-Driven 3DIC Design Methodology

   Dr. Michael Liu

   Product Director，Empyrean Technology Co., Ltd，China  

Abstract:

In the post-Moore era, the traditional transistor miniaturization roadmap is approaching fundamental physical limits, making chiplet-based systems a critical solution to break through the bottlenecks of chip performance and cost. Driven by the evolving trends of semiconductor technology, this presentation systematically sorts out the evolutionary logic and future development directions of the STCO design methodology. It thoroughly analyzes the technical transition trajectory spanning from 2.5D integration to 3DIC, as well as the core transformations and inherent connotations behind the upgrade of design methodologies from DTCO to STCO. Combined with industrial implementation practices, this talk also introduces domestic end-to-end design flows for 2.5D chiplets and 3DIC, demonstrating the implementation pathway of advanced packaging and co-design of entire systems amid indigenous innovation of domestic EDA tools.

Speaker's Biography:     

Michael Liu is the senior product director of Empyrean Technology. He has more than 10 years of experience in ASIC chip design, manufacturing, and packaging EDA software product development and management, focusing on the planning, development, and promotion of EDA products. He helps Empyrean build up a mature Analog/Mixed-Signal design flow, and expand it to the fields of other full custom design such as flat panel display, signal chain, memory, RF and optoelectronics. He is building a reliability design methodology for design-manufacturing collaboration and a PPAC-oriented design-manufacturingpackaging collaborative design solution. The solutions are widely adopted by national and international leading design houses.