TGV Full-Process AOI Inspection Technology and Solutions

Cruise YANG

R&D Director, Shenzhen HanSuper Precision Measurement Co., Ltd.   

Abstract:

With the development of advanced packaging technology towards high integration and miniaturization, glass substrate through-hole (TGV) has become the core carrier of new generation packaging due to its excellent high frequency performance and thermal stability. In this presentation, HONY will analyze the entire TGV process flow - from incoming material inspection, laser induction, chemical etching, to PVD/electroplating metallization and RDL (re-delayed wiring layer) preparation with key AOI technologies and solutions.

At the same time, the AOI inspection equipment independently developed by Hansuper will be introduced, covering the innovative inspection principle, the intelligent repair closed loop, and the full-process data traceability. Have in-depth exchanges with industry colleagues on the best practices and technical challenges of TGV full-process quality monitoring, jointly explore the key role of AOI in promoting the development of advanced glass-based packaging technology, and promote process optimization and yield improvement.

Speaker's Biography:

Cruise Yang, R&D Director of Shenzhen HanSuper Precision Measurement Co., Ltd, graduated from Harbin Institute of Technology in 2015, engaged in image processing, deep learning algorithms and software products research and development after graduation, has applied for more than 100 invention patents, has been authorized 60 +, won a number of provincial and ministerial awards, in semiconductors, new energy, automotive electronics and other industry sectors to accumulate a wealth of R & D experience.