The Study of Warpage and Micro-Structure Measurement with Optical Metrological Technologies in Advanced Packaging Process

Dr. Joonho You

CEO, Nexensor Inc.   

Abstract:

Advanced packaging technologies are vital in semiconductor manufacturing for applications like mobile devices, AI, and data servers. These require precise metrology to maintain structural and functional integrity, focusing on wafer warpage, microstructure geometry, and TSV depth. Key methods include interferometry and pattern projection profilometry for their precision and repeatability.

This study explores non-contact optical techniques to measure wafer- and die-level warpage and analyze RDL and TSV structures. Techniques like deflectometry and Moiré patterns are used for full-wafer warpage, while real-time optical interferometry captures die-level deformation. For depth and topography, white light and spectral interferometry provide accurate 3D maps and depth data. These methods are effective on various substrates. Overall, advanced interferometric metrology is essential for quality control in next-generation semiconductor packaging.

Speaker's Biography:

Joonho You is currently the CEO of Nexensor Inc. He studied optical measurement at KAIST (Korea Advanced Institute of Science and Technology) and has over 20 years of experience in research, development, and commercialization in this field. His research interests include interferometry technology, thin-film measurement technology, shape measurement techniques using pattern projection methods such as deflectometry and Moiré, and fiber optic-based thickness sensors.