The Domestic Development, Research, and Application of IC  Substrate Materials

Dr. Yue JIANG

Deputy General Manager, Guangdong  EPS  Technology Co.,Ltd.   

Abstract:

By analyzing the development trends of the IC substrate material industry through semiconductor industry chain data, the differences in market share and position between domestic and foreign markets, this article focuses on the research and application progress of domestic manufacturers in BT resin substrates, BF film materials, and plastic packaging materials. It also highlights the application scenarios and opportunities provided by advanced packaging technology for IC substrate materials. As a domestic IC substrate material supplier, EPS showcases its research and development ideas, major technological innovations, and breakthroughs in barriers.

Speaker's Biography:

Yue JIANG, male, was born in 1983, graduated from Hunan University in 2009 with postgraduate degree. Currently, Jiang Yue is working in the company of Guangdong EPS Technology Co.,Ltd, with the title of deputy general manager of marketing department, and right now mainly focus on market development & application for BT copper clad laminates (CCL) and Low-CTE high speed copper clad laminates (CCL) products. Jiang Yue once worked at Guangzhou Fastprint Circuit Tech Co.,LTD for more than 5 years, mainly responsible for PCB new process R&D and copper clad laminate evaluation, during that period Jiang Yue had one professional paper published and obtained one practical application patent. Later, Jiang Yue held the position of marketing director at the company of Isola and Nouya New Material Technology Co.,Ltd respectively, mainly responsible for BT、high-speed products market promotion. Jiang Yue was proficient with PCB and Copper Clad Laminate knowledges, meanwhile with deep understanding of CCL application in OEM Products, and accumulated rich working experience in the fields.