Hybrid Copper Bonding: A Key to High-Performance 3D Integration

Prof. Sarah Eunkyung Kim

Seoul National University of Science and Technology   

Speaker Biography:

Sarah E. Kim, Ph.D., is a professor in the Department of Semiconductor Engineering at Seoul National University of Science and Technology. She received her B.S. and Ph.D. from Rensselaer Polytechnic Institute and her M.S. from Massachusetts Institute of Technology. Dr. Kim previously worked at Samsung Electronics and held senior engineering and leadership roles at Intel, focusing on BEOL interconnects, 3D integration, and wafer-level packaging. She also served as a senior research scientist at the Korea Institute of Science and Technology. Since 2007, she has been a faculty member at Seoul National University of Science and Technology, where her research centers on interconnect integration and hybrid Cu bonding. Dr. Kim holds numerous U.S. patents and has published extensively throughout her career. For more information, visit: https://esl.seoultech.ac.kr