Hybrid Copper Bonding: A Key to High-Performance 3D Integration

Prof. Sarah Eunkyung Kim

Seoul National University of Science and Technology   

Abstract:

As semiconductor devices continue to scale down and the demand for higher performance grows, advanced packaging technologies have become critical enablers of next-generation systems. This talk will explore current trends in packaging technology, with a focus on hybrid Cu bonding as a key interconnect solution for 3D integration. Hybrid Cu bonding offers substantial advantages over conventional bonding methods, including improved electrical performance, finer pitch scaling, and enhanced thermal management. However, achieving high-quality and reliable hybrid Cu bonds requires careful control of multiple factors such as surface planarity, oxide properties, surface pretreatment, and hydrophilicity. This presentation will provide an overview of recent research conducted in our laboratory, offering insights into pretreatment development, bonding mechanisms, and future directions for hybrid Cu bonding technology.

Speaker's Biography:

Sarah E. Kim, Ph.D., is a professor in the Department of Semiconductor Engineering at Seoul National University of Science and Technology. She received her B.S. and Ph.D. from Rensselaer Polytechnic Institute and her M.S. from Massachusetts Institute of Technology. Dr. Kim previously worked at Samsung Electronics and held senior engineering and leadership roles at Intel, focusing on BEOL interconnects, 3D integration, and wafer-level packaging. She also served as a senior research scientist at the Korea Institute of Science and Technology. Since 2007, she has been a faculty member at Seoul National University of Science and Technology, where her research centers on interconnect integration and hybrid Cu bonding. Dr. Kim holds numerous U.S. patents and has published extensively throughout her career. For more information, visit: https://esl.seoultech.ac.kr