Physically Aware Logic Synthesis in the AI Era

  Dr. Keren Zhu

  Assistant Professor，Fudan University，China

Abstract:

As Moore's law slows, 3D integration and advanced packaging are key to continued scaling. Yet logic synthesis is still done in a 2D mindset, where key decisions are made before physical and packaging realities are known, leaving a wide gap between logic level estimates and post layout quality. This talk argues that synthesis must become physically aware, and increasingly 3D aware. I will present our AI driven work bridging synthesis and physical design: PigMap, a physically aware technology mapping framework, and PhyLS, a full stack physically aware synthesis platform. I will then look ahead to 3D, extending these ideas to inter die partitioning, vertical interconnects, and thermal and packaging constraints, and share open challenges in co optimizing logic, layout, and packaging together.

Speaker's Biography:

Keren Zhu is an Assistant Professor at Fudan University. He received his Ph.D. from the University of Texas at Austin under Prof. David Z. Pan. His research lies at the intersection of EDA, AI, and chip design, with a focus on AI empowered circuit design and optimization. He has published over 60 papers in leading EDA venues and is a main developer of the open source analog layout tool MAGICAL. He serves on the technical program committees of DAC, ICCAD, GLVLSI, and MLCAD, and as IEEE CEDA Shanghai Chapter Chair. He was named to the MIT Technology Review Innovators Under 35 Asia Pacific list and selected for national level young talent programs.