Challenges in Advanced Packaging for High Performance Computing

Dr. Cheng YANG

Scientist, JCET Group Co., Ltd.  

Speaker Biography:

Dr. Yang has more than 25 years' experience in electronics system and IC packaging development. At present he is scientist (corporate fellow) at JCET. Before joining JCET, he was at Flex on SiP products and technology development in IoT, automotive, medical, and industrial applications, covering design, manufacturing, and testing areas. He has worked at Intel on memory packaging design and technology development for 13 years. Dr. Yang hold a Ph.D. degree from National University of Singapore, EMBA from Washington University in St. Louis, and Master and Bachelor from Shanghai Jiaotong University.