The Synergy of PLP and Glass Core Substrate Supporting the Growing Demands of AI

Dr. Yik-Yee TAN

Principal Market & Technology Analyst, Yole Group      

Abstract:

In advanced packaging, two emerging technologies are gaining significant traction from industry. Panel Level Packaging (PLP) and glass core substrates. PLP offers a cost-efficient solution, ideal to use in WLCSP, fan-out and 2.5D interposers processing. Meanwhile, glass core substrate represents a promising material innovation aimed at overcoming the limitation of organic substrate, particularly in high-performance computing environments such as future data centers and AI applications. Both technologies are essential to meet the growing demand for AI which requires higher transmission speeds and bandwidth. This presentation will provide a comprehensive overview of the market outlook for PLP and glass core substrates, explore the associated challenges and opportunities, and discuss the supply chain's reaction and readiness.

Speaker's Biography:

Dr. Yik-Yee TAN is a Principal Market & Technology Analyst, Semiconductor Packaging at Yole Group. Dr. Tan holds a Ph.D. in Engineering from Multimedia University (MMU, Malaysia). She has more than 25 years of experience in semiconductor packaging. Based on her technical expertise and market knowledge, she develops technology & market reports and is engaged in dedicated custom projects. Prior to Yole, Dr. Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at Onsemi (Malaysia).  She published more than 30 papers and held 3 patents.