Modeling and Simulation of Advanced Packaging with COMSOL

Zhenhong ZHONG

Technical Manager, COMSOL China 

Abstract:

Advanced packaging has become a key technology for the continuation of Moore's Law in the semiconductor industry. Different from traditional processes, advanced packaging includes both semiconductor manufacturing and packaging processes to integrate multiple devices for boosting system performance and overcoming technical and commercial challenges. This requires higher demands for manufacturing and packaging processes, which often involve complex physical interactions. COMSOL provides the ability to accurately model and simulate coupled or multiphysics phenomena, delivering critical insights for resolving advanced packaging challenges.

This presentation will show the applications of COMSOL in the area of advanced packaging, such as wafer-level packaging and 2.5D/3D integration. Key topics include simulations of TSV fabrication, hybrid bonding, flip-chip assembly, and laser dicing processes, along with reliability assessments of TSVs and microbumps, thermal management strategies for high-density packages, and signal integrity analysis of interconnects.

Speaker's Biography:

Zhenhong ZHONG is a technical manager at COMSOL China. He is responsible for the technical support of COMSOL products in the areas of structural mechanics, acoustics, electromagnetics and optics, etc. He graduated from Fudan University, specialized in theoretical and applied mechanics, and has rich experience in numerical simulations.