Trends and Development Paths of Board-level Packaging

Dr. Kang ZHANG

R&D Director, Chengdu ECHINT Technology Co., Ltd.   

Speaker Biography:

Kang ZHANG, a doctoral in integrated circuits from the University of Electronic Science and Technology of China, is the R&D director of Chengdu Yicheng Technology Co., Ltd. He has been engaged in research on advanced Panellevel packaging technologies for a long time. Currently, he is mainly implementation of glass packaging and glass substrates.