Nano Materials and Polymer Composites for Electronic Packaging

Dr. Daniel Lu

Vice President, Henkel Corporation      

Abstract: 

Nano materials and polymer composites are widely used in electronic devices as adhesives, encapsulants, thermal interface materials, insulators, dielectrics, conducting elements for interconnects. This short course will provide overview on the latest advancement of nano materials and composites, and their impact to advanced electronics packaging and integration.

Lecturer Biography:

Dr. Daniel Lu is the Vice President of Henkel Corporation, he has over 25 years of experience in advanced semiconductor packaging and integration materials and processes. He received his MS and PhD degrees on Polymer Science and Engineering from Georgia Institute of Technology in 1996 and 2000, respectively. Dr. Lu received many awards including 2017 IEEE EPS Electronic Manufacturing Technology Award, the IEEE/EPS Outstanding Young Engineer Award in 2004, the IEEE ECTC best poster paper in 2007, Intel’s most patent filing in 2003-2007, etc. Dr. Lu has published more than 50 journal papers, wrote chapters for six books, and holds more than 100 US and international patents. He is the editor of the books “Materials for Advanced Packaging (2008 edition and 2017 edition)” and co-author of the book “Electronically Conductive Adhesives with Nanotechnologies (2009)”.  Dr. Lu is IEEE Fellow, and an associate editor of IEEE Transactions on Advanced Packaging and Journal of Nanomaterials, and an editorial board member of Nanoscience & Nanotechnology-Asia. Dr. Lu also serves as the adjunct professor in Huazhong University of Science and Technology, SIAT (Shenzhen Institute of Advanced Technologies), Chinese Academy of Science, and the Chinese University of Hongkong. Dr. Lu is also an industrial advisor to Fudan University.