The Application and Development of Silicon Photonics and Advanced Packaging Technologies

Mr. Scott CHEN

ASE (Advanced Semiconductor Engineering), Taiwan, China

Abstract:

The surging demand for AI computing power has driven rapid growth in advanced packaging technologies. However, power consumption, thermal management, and bandwidth limitations have become key bottlenecks to further performance improvements. Silicon photonics-based advanced packaging leverages the properties of light to address these challenges by reducing heat, lowering energy consumption, and increasing bandwidth.

By integrating co-packaged optics (CPO), 3D stacking, and through-silicon vias (TSVs), a high level of system integration can be achieved. This presentation will introduce the development and future outlook of advanced packaging and silicon photonic co-packaging technologies.

Speaker's Biography:

Scott received B.S. degree in Chemical Engineering from NTU (National Taiwan University). And Master degree of Executive MBA Program from NTU. He has been worked on each of assy technology , MEMS nsor, bumping, flip chip , advance package technology and SIP solution over 30 yrs.