iHBC-7 - ICEPT

Position :HomePROGRAMHybrid Bonding Technology

SPONSORED BY

ORGANIZED BY

Meeting Secretary

Xiaoxiao JI（Submit Contact）

18621199790

icept@fsemi.tech

Wen YIN

0086-010-82995675

Conference Registration

Yico WANG

0086-13121110782

0086-010-64655251

support@fsemi.tech

Conference Sponsorship

Janey SHI

0086-13661508648

janey@fsemi.tech

Judy ZHOU

0086-13683163150

juanjuan.zhou@fsemi.tech

iHBC-7

TBD

Mr. Chaoqun REN

Wisdom SemiTeC (jiangsu) Technology Co., Ltd, China

Speaker's Biography:

Mr. Ren Chaoqun has deep dived in the semiconductor equipment manufacturing sector, focusing on the research and development of core technologies of semiconductor equipment, and has accumulated rich experience in research, design, development, and management.

Currently, he serves as CEO of Wisdom SemiTeC (Jiangsu) Technology Co., Ltd., fully in charge of the company's operation and the formulation and implementation of its technical strategy. He has led the research and development of the company's core hybrid bonding products and continuously explores and innovates in the uncharted territory of semiconductor technology.