Pushing The Limit of Bonding Accuracy and Throughput

Mr. Bin ZHAO

iStar, China

Abstract:

iStar introduce iHCB3000 hybrid bonding equipment's innovative architecture to improve bonding accuracy and throughput, and demonstration of initial testing results.

 Outline:

1. Challenge on the chip to wafer hybrid bonding equipment by advanced chip-let process

2. iStar’s innovative architecture of hybrid c2w bonding equipment

3. Demonstration of initial testing results

Who Should Attend:

Audiences interested in innovative technologies for high-performance hybrid chip bonding equipmen.

Speaker's Biography:

Mr. Zhao Bin has nearly 20 years of experience in the field of semiconductor equipment research and development. He specializes in system architecture design, system analysis, design of innovative solutions, and solve complex cross-disciplinary technical issues. He has in-depth understandings on the systems architecture and process technology of lithography equipment, chip and wafer bonding equipment. At iStar, he focuses on the innovative technology development of high-end semiconductor process equipment.