Technology & Fusion, enabling AI innovation

    Mr. Norito Matsumura
    Senior Director, Tokyo Electron

Abstract: 

The need for die-to-wafer (D2W) and wafer-to-wafer (W2W) hybrid bonding to support the Advanced Packaging (AP) technology essential for both High Performance Computing and Artificial Intelligence applications is well-established. In turn, AP and its associated process integration flows are enabled by an overall ecosystem and supply chain, a critical component of which is state-of-the art, intelligent hybrid bonding tools. These tools must meet the technical performance, economic (cost of ownership), and timeline requirements of AP end-customers. To achieve these requirements, the path from concept and early development to a production-worthy tool, especially with ever shorter customer timelines, is very challenging. In combination with judicious design, well-defined characterization experiments, and systematic data collection for repeatability/ trends/ validation, fundamental understanding can provide invaluable guidance into the design and development of the module-level chambers, platforms, and processes. Diagnostic testing and physics-based computer simulation play a vital role in this fundamental understanding. For hybrid bonding interface quality is paramount, requiring optimization of process integration and surface preparation steps. Furthermore, to guide development and validate the process/hardware capabilities, process integration engineering teams must design and fabricate effective hybrid bonding test vehicles.

In this presentation, we will explore the fundamental to volume manufacturing tools, and introduce Tokyo Electron's solutions.

Speaker's Biography:

Norito Matsumura is senior director of Tokyo Electron Limited(TEL), responsible for marketing in Global Sales Division.

He has worked over 35 years in TEL and more than 30 years’ experience in Semiconductor industry as marketing professional..

Successfully launched new type of products in Dry etch, Wet Clean, Dry Clean, Spin-on Dielectric deposition, contributed to advanced customer’s technology innovations in worldwide.

In 2017, he moved to Corporate Division as Account Technology, developed new marketing programs for leading edge customers, contributed for No.1 position.

In 2019-2021, he acted vice president of technical marketing of Tokyo Electron (Shanghai), supported several emerging customer’s startup & business success in China.  

After 2022, he worked as advisory staff for SVP in Backend Process Business division.