Sinterconnects® as a Platform for Double‑Sided‑sintered WBG Power Modules

   Ali Roshanghias

   Silicon Austria Labs (SAL)

Abstract: :

Wide-bandgap power devices have enabled substantial gains in switching performance and power efficiency; however the conventional interconnects (e.g. wire bonds) increasingly determines the achievable electrical loss, parasitic inductance, and thermal headroom at the module level. Sinterconnects® is introduced as a wire-bondless, planar top-side interconnect approach based on copper sintering that is intended to provide reduced conduction losses and improved heat spreading, while supporting double-sided-cooled WBG power module concepts. In this talk, we will present how Sinterconnect® are leveraged to implement not only top-side water cooling in power module but also realizes intelligent power modules by direct integration of sensors on Sinterconnects ®.  

Speaker's Biography: 

Dr. Ali Roshanghias is Head of the Research Unit for Heterogeneous Integration Technologies (HIT) at Silicon Austria Labs (SAL). He received his Ph.D. in Materials Science and Technology in 2012 and subsequently worked as a postdoctoral researcher in Japan and Austria, focusing on electronic materials and advanced microelectronics packaging. In 2015, he joined Silicon Austria Labs (formerly CTR Carinthian Tech Research AG). He is the author of more than 100 scientific papers and patents and serves as a lecturer at the University of Klagenfurt. His research interests include heterogeneous integration technologies, interconnect materials, hybrid flexible electronics, and 3D integration.