QULET：Quantum Chiplet  Integration Technology for Superconducting Quantum Computing

  Dr. Jiexun YU

  Doctoral candidate at School of Integrated Circuits, Tsinghua University，China

Abstract:

Quantum computing has attracted widespread attention owing to its exponential advantage over classical computing towards specific scientific problems. Superconducting quantum computing has become one of the most promising mainstream physical platforms candidates for realizing universal quantum computing. Traditional 2D wire bonding interconnection technology cannot meet packaging requirements of large-scale quantum processors.  This report introduces a modular QULET quantum chiplet integration architecture and its corresponding interlayer interconnection technology (superconducting indium bumps for room temperature flip chip bonding), as well as intra-layer interconnection technology (superconducting TSV interposer). Furthermore, an outlook on the heterogeneous integration and optoelectronic hybrid trends of future 3D quantum packaging technology has presented.

Speaker's Biography: 

Jiexun Yu is a doctoral candidate at School of Integrated Circuits, Tsinghua University. His major research interests is in advanced packaging and superconducting quantum three-dimensional integration technology. He has published six articles in prestigious journals and conferences such as IEEE EDL, TED, and ECTC at the first author. He serves as a reviewer for IEEE TMTT and has applied for over 20 national invention patents and PCT international invention patents, also he has participated in the publication of two translated books. Yu Jiexun has been honored with several awards, including Ministry of Education's High-level Talent Program for Integrated Circuits, Ministry of Education's Endeavour Scholarship, the National Scholarship.