Glass Packaging

    Dr. John H Lau 

    Chief Scientist of Unimicron Technology Corporation, Taiwan, China  

Abstract: 

Since the announcement of TSMC’s CoPoS (chip on panel on substrate) in 2025, the glass packaging has been getting lots of traction for high-end and high-performance applications. Today, the package of choice of HPC (high-performance computing) driven by AI (artificial intelligence) is the CoWoS (chip on wafer on substrate). The TSV (through-silicon via) interposer of CoWoS is fabricated on a silicon wafer. However, because of the area efficiency (lower cost), the TSV-interposer is replaced by the TGV (through-glass via) interposer (CoPoS) which is fabricated on a glass panel. CoPoS is scheduled to be shipped in Q1 of 2029. In this lecture, a brief fundamental of glass packaging will be presented. Also, flip chips on glass substrates with microbums and Cu-Cu hybrid bonding have been analyzed . Some recommendations will be provided.