End-to-End TGV AOI Metrology for Mass Production

  Mr.Yang Yang

                       R&D Director，Shenzhen Hanswell Technology Co., Ltd.

Abstract:

Mass production faces tough hurdles. Material batches fluctuate. Laser induction lacks consistency. Thermal mismatch occurs between copper and glass. Glass is brittle and fragile. Every step holds hidden risks.

Traditional inspection is struggling. Sampling misses too many defects. Standard optics fail to see inside transparent substrates. Data silos hide the root cause of failures. These issues slow down the entire industry.

The Solution: Hanswell's Full-Process Inspection

We rely on our proprietary intelligent vision platform. We fuse multi-modal technologies like AOI, 3D Metrology, and X-ray. We offer a complete solution for mass production.

We cover every single step:

Incoming materials

· Laser induction & wet etching

· PVD & electroplating

· Grinding & polishing

· RDL processing

We achieve a closed-loop detection system. Data flows seamlessly across all stages. Our equipment fits fully automated lines perfectly.

· Key Performance Metrics

· Sensitivity: 200nm

· 3D Repeatability: <10nm

· Throughput: 20 WPH (Wafers Per Hour)

· Empowering Smart Manufacturing

We are shifting from "post-event sampling" to "full-process smart control." Top semiconductor packaging manufacturers trust us. We empower Chinese manufacturing with higher precision and reliability.

Speaker's Biography: 

Yang Yang, R&D Director of Shenzhen Hanswell Technology Co., Ltd., graduated from Harbin Institute of Technology in 2015, engaged in image processing, deep learning algorithms and software products research and development after graduation, has applied for more than 100 invention patents, has been authorized 90 +, won a number of provincial and ministerial awards, in semiconductors, new energy, automotive electronics and other industry sectors to accumulate a wealth of R&D experience.