High-speed transmission packaging technology and power packaging technology

  Mr. Kazuyuki Nakagawa

  Senior Manager, Packaging & Assembly Division，Renesas Electronics Corporation, Japan

Abstract:

56Gbps PAM4 with 50 cm electric transmission, AC-coupling (DC-block) high speed serial transmission FCBGA technology, power pkg of Ag/Cu sintering technology, power pkg of heavy Al and Cu wiring with Al ribbon stack technology.