Semiconductor Equipment Supply Chain for FEOL Advanced Packaging

Dr. Kitty Pearsall

IEEE EPS DL, Independent Consultant, USA   

Abstract:

The global semiconductor industry, valued at more than $650 billion in 2024 market is projected to surpass $710 billion by end of 2025 (Gartner). This growth is viewed positively in the light of the recent Covid pandemic and ongoing supply chain disruptions. Since disruptions (all kinds) in the semiconductor supply chain are not going away the semiconductor companies must ensure that their entire 'supply chain (SC) eco-system' is complete, efficient, and resilient. This includes associated manufacturing equipment being available to meet the advanced packaging technology needs. A pyramid infrastructure is used to highlight the critical segments of the chip manufacturing fabrication process. The essential needs and requirements, beginning to end, of the chip fabrication process eco-system will be discussed. This includes the intersection of the entities involved, upstream and downstream suppliers, associated manufacturing equipment companies, and all vendors and distributors for each segment. This includes chip design, chip design verification, wafer manufacturing, key essential raw materials, packaging, and assembly and test regardless of the entity type (foundry, OSAT facility, or an IDM). The final chip, designed into a sub-assembly, a device, or a system is sold to end customers. A discussion of the key equipment used in the FEOL wafer fabrication processes are highlighted.

Speaker's Biography: 

Kitty Pearsall received the BS degree in Metallurgical Engineering and her MS and PhD degrees in Mechanical Engineering and Materials from the University of Texas. Across my 41-year career at IBM, I was appointed to strategic roles in the Integrated Supply Chain while implementing global cross commodity processes/products. Since closing Boss Precision Inc at the end of March 2024, Kitty is currently an independent consultant. Kitty has been an active member of IEEE for 34 years as well as an EPS member for 29 years, with growing roles and responsibilities, including EPS Past President and a member of the EPS Board of Governors since 2005. Kitty holds 13 US Patents and 8 published IP disclosures. Kitty has been recognized by IBM with many outstanding technical awards, by the University of Texas in Austin and by the IEEE Electronic Packaging Society. These include, but not limited to, those mentioned below: 

EPS Distinguished Lecturer 

EPS David Feldman Award 

IBM Distinguished Engineer in Integrated Supply Chain 

Member of the IBM Academy of Technology

IBM Women in Technology Fran E. Allan Mentoring Award