Moldex3D Advanced Packaging Molding Analysis Solution and Latest Technological Advancements

  Dr. Leo Shen

                       CoreTech System Co., Ltd. (Moldex3D)

Abstract:

As advanced packaging continues to move toward higher density, multi-chip integration, large-area formats, and thinner package structures, the challenges associated with molding flow, warpage, deformation, and reliability have become increasingly complex. This presentation introduces Moldex3D’s comprehensive molding analysis solutions and latest technological advancements for advanced packaging applications. Key topics include Capillary Underfill, Compression Molding, Molded Underfill, and massive-bump flow analysis for wafer-level and panel-level packaging. The presentation will also address warpage and deformation analysis for PLP, covering critical issues such as nonlinear warpage, post-mold cure stress relaxation, and warpage control. In addition, reliability assessment technologies, including thermal cycling fatigue life prediction and delamination alert capabilities, will be discussed. By integrating full-process simulation, advanced material characterization and modeling, and continuously improved computational efficiency, Moldex3D enables engineering teams to identify process risks at an early stage, optimize process parameters, and enhance both development efficiency and product reliability in advanced packaging.

Speaker's Biography: 

Dr. Shen received his Ph.D. from National Taiwan University and has over a decade of experience in IC packaging simulation and numerical analysis. His technical expertise spans computational fluid dynamics, numerical methodologies, and structural analysis, with a strong focus on applying advanced simulation technologies to IC packaging design and manufacturing challenges.

Dr. Shen has authored and co-authored over 100 academic and technical publications, including SCI journal papers, international conference papers, and professional technical presentations. He has also been invited to deliver lectures and short courses at leading institutions such as National Taiwan University, National Yang Ming Chiao Tung University, and National Cheng Kung University, as well as in international programs such as NCKU–MIT collaborations.

At Moldex3D, Dr. Shen leads the development and product planning of advanced IC packaging simulation solutions, contributing to innovations that improve simulation efficiency, process optimization, and product quality in advanced packaging applications.