
Multi Field Cross Scale Collaborative Design Methods and Technologies for Chip Manufacturing and Integration
Prof. Sheng LIU
Academician of CAS, Dean of School of Power and Mechanical Engineering, Wuhan University
Speaker's Biography:
Multi Field Cross Scale Collaborative
Design Methods and Technologies for
Chip Manufacturing and Integration
Prof. Sheng LIU, Academician of CAS, Wuhan University,
China
Sheng Liu is a professor at Wuhan University, a Ph.D. at Stanford University, an ASME Fellow
and an IEEE Fellow. He is an expert in the field of micro-nano manufacturing and a leader in
domestic chip packaging technology. He was elected as an academician of the Chinese
Academy of Sciences in 2023. Academician Liu Sheng has achieved systematic innovation
results in micro-nano manufacturing science and engineering technology (involving integrated
circuits, light-emitting diodes LED, micro-sensors, power electronics IGBT and other chip
packaging). As the first completer, he won the first prize of the 2020 National Science and
Technology Progress Award, the second prize of the 2016 National Technology Invention
Award, the first prize of the 2015 Ministry of Education Technology Invention Award, the 2018
First Prize of the Electronic Society Technology Invention Award, and the 2009 IEEE
International Electronics Award. Outstanding Technical Achievement Award of the Packaging
Society (1 person per year in the world, the first person in China), 2009 Special Achievement
Award of the China Electronics Society, 1997 International Microelectronics and Packaging
Society (IMAPS) Technical Contribution Award, 1995 U.S. Presidential Professor Award (30 in
that year) people), and was selected into the first batch of National Distinguished Youth
(overseas) projects in 1999 (only 7 people were selected that year). Published 424 SCI papers,
more than 6,600 SCI citations, 6 monographs (4 in English), and 196 authorized invention
patents.