Advanced Packaging Equipment Empowers a New Ecosystem of Heterogeneous Integration

  Mr. Fei Yu 

  Director of Marketing, Product & Solution，Beijing NAURA Microelectronics Equipment Co.,Ltd.

Abstract:  

Focusing on the development trends of advanced packaging, we commit to hybrid bonding technology, fully deploy equipment and process systems for 3D stacking, build systematic one-stop solutions, and accelerate the industrial application of 3D stacking technology.

Speaker's Biography: 

Yu Fei, Market & Product Solution Director of POP Business Unit, Naura Technology Group, Senior Engineer. With over ten years of experience in the development of semiconductor manufacturing equipment, he has long been deeply engaged in the field of advanced packaging. He is proficient in core processes of etching and bonding, boasts profound technical expertise, and possesses extensive industrial R&D and implementation experience.