2026 27th International Conference on Electronic Packaging Technology
English
Chinese
主办方
承办方
CONTACT US
Meeting Secretary
Xiaoqing WEI（Submit Contact）
18392959178
icept@fsemi.tech
Wen YIN
0086-010-82995675
Conference Registration
Yico WANG
0086-13121110782
faithsh@yeah.net
Juanjuan ZHOU
0086-010-64655241
271617588@qq.com
Conference Sponsorship
Yueru SHI
0086-13661508648
janey.shi@cepem.com.cn
贴芯
HOSTED BY
ORGANIZED BY
Schoot of Electronic Science and Engineering
Dongxue LIANG
0086-0592-2188342
icept2021@xmu.edu.cn
Fenghua GAN
0086-021-38953725
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